[PDF.63ew] Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials

[PDF.kh89] Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of  Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann epub
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Chemical Mechanical Planarization of  Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann book review
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 | #2519251 in Books |  1997-01-31 | Ingredients: Example Ingredients | Original language:English | PDF # 1 |  9.70 x.90 x6.95l,1.68 | File type: PDF | 337 pages

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||5 of 5 people found the following review helpful.| Surprisingly bad|By A Customer|There are so many errors in this book that I cannot imagine how can anybody rely on any information contained here. The book is probably simply showing the current understanding of CMP, which is poor, but this still cannot justify bluntly bad science. The authors describe all important concepts of CMP like Preston equation, Pourbaix diagrams, bu|From the Publisher|This succinct reference/textbook deals with chemical and polishing techniques for electronic materials. Explains how to use the chemical mechanical planarization (CMP) process to improve the electronic properties of such substances as tungsten

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and ...

You easily download any file type for your device.Chemical Mechanical Planarization of Microelectronic Materials   |  Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann. A good, fresh read, highly recommended.

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