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| #526091 in Books | 1995-12-01 | Original language:English | PDF # 1 | 8.80 x1.40 x6.20l, | File type: PDF | 560 pages||4 of 4 people found the following review helpful.| It's a good text for studying micro-interconnection.|By A Customer|It's a well organized book for expounding flip chip bonding, easy to understand. I like it. but the topic of the parts of new technologies, or high-end industries were not to be enough.|About the Author|John H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois (1977), a M.A.Sc. degree in Structural Engineering from the University of British Columbia (1973), a second M.S. degree in Engineering Ph
The electronics industry is abuzz with talk of flip chip technologies (FCT), the group of revolutionary new techniques that enable chips to be connected to substrates without the use of wires. By literally placing the chip upside down and in direct contact with the substrate, FCT is a highly efficient-and increasingly popular-alternative to traditional bonding techniques. This is the first book to cover all of the major design, materials, and manufacturing issues related...
You easily download any file type for your device.Flip Chip Technologies | John H. Lau. I really enjoyed this book and have already told so many people about it!
