[PDF.97cx] Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)

[PDF.ml45] Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)

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 | #697463 in Books |  1997-04-24 | Ingredients: Example Ingredients | Original language:English | PDF # 1 |  10.75 x7.50 x.75l,2.09 | File type: PDF | 336 pages

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||0 of 0 people found the following review helpful.| Four Stars|By Customer|A+++

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for l...

You can specify the type of files you want, for your gadget.Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)   |  Pradeep Lall, Michael Pecht, Edward B. Hakim. Which are the reasons I like to read books. Great story by a great author.

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