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Micromachining and Micropackaging of Transducers (Studies in Electrical and Electronic Engineering)
C. D. Fung, Peter W. Cheung, Wen H. Ko, David G. Fleming
[PDF.ld61] Micromachining and Micropackaging of Transducers (Studies in Electrical and Electronic Engineering)
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| #6666508 in Books | 1986-02 | Original language:English | PDF # 1 | File type: PDF | 252 pages|
Covering the technology of the formation and packaging of microstructures for transducer applications, the papers in this book address isotropical and anisotropical etching of silicon and other materials by electrochemical, chemical and other techniques; and describe the adaptation of advanced integrated circuit technology and laser drilling to novel microstructures. Packaging considerations and materials (including various encapsulants, adhesives and specialty polymers)...
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