[PDF.49xa] System-In-Package: Electrical and Layout Perspectives (Foundations and Trends(r) in Electronic Design Automation)

System-In-Package: Electrical and Layout Perspectives (Foundations and Trends(r) in Electronic Design Automation)

[PDF.nu82] System-In-Package: Electrical and Layout Perspectives (Foundations and Trends(r) in Electronic Design Automation)

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 |  Now Publishers Inc |  2011-06-20 | Original language:English | PDF # 1 |  9.21 x.19 x6.14l,.32 | File type: PDF | 94 pages

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With the increasing scalability of semiconductor processes, the higher level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single syst...

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