[PDF.71ni] System on Package: Miniaturization of the Entire System

System on Package: Miniaturization of the Entire System

[PDF.xu30] System on Package: Miniaturization of the Entire System

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 | #610390 in Books |  Rao Tummala |  2008-05-06 | Original language:English | PDF # 1 |  9.50 x1.44 x7.70l,3.08 | File type: PDF | 785 pages

 | System on Package Miniaturization of the Entire System

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||About the Author|Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions...

You easily download any file type for your device.System on Package: Miniaturization of the Entire System   |  Rao Tummala. Which are the reasons I like to read books. Great story by a great author.

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