| #8528614 in Books | Now Publishers Inc | 2011-05-21 | Original language:English | PDF # 1 | 9.21 x.35 x6.14l,.53 | File type: PDF | 166 pages | |
Three-dimensional integrated circuits (3D ICs) offer many benefits for future microprocessor designs. Amongst these is the potential for overcoming the barriers in interconnect scaling, thereby offering an opportunity to continue performance improvements using CMOS technology. As the fabrication of 3D integrated circuits has become viable, developing CAD tools and architectural techniques are imperative for the successful adoption of 3D integration technology. Three-dime...
You easily download any file type for your gadget.Three-Dimensional Integrated Circuits: Design, Eda, and Architecture (Foundations and Trends(r) in Electronic Design Automation) | Guangyu Sun, Yibo Chen, Xiangyu Dong. I have read it a couple of times and even shared with my family members. Really good. Couldnt put it down.
