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WIRE BONDING IN MICROELECTRONICS, 3/E
George Harman
[PDF.fa71] WIRE BONDING IN MICROELECTRONICS, 3/E
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| #499317 in Books | imusti | 2010-02-10 | Original language:English | PDF # 1 | 9.40 x1.17 x6.40l,1.75 | File type: PDF | 446 pages | McGraw-Hill Professional Publishing||0 of 0 people found the following review helpful.| Still the best resource for wire bonding information|By Customer|Wire Bonding in Microelectronics continues to be the definitive resource for wire bonding information.|0 of 0 people found the following review helpful.| The book is great! Both in quality of the book and on ...|By Customer|The book is great! Both in quality of|About the Author|George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.
The Industry Standard Guide to Wire Bonding--Fully Updated
The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge tech...
You can specify the type of files you want, for your gadget.WIRE BONDING IN MICROELECTRONICS, 3/E | George Harman. A good, fresh read, highly recommended.